The Lee Teng Undergraduate Internship in Accelerator Science and Engineering has been established by the Illinois Accelerator Institute to attract undergraduate students into the exciting and challenging world of particle accelerator physics and technology.
A limited number of highly qualified students will be selected into this program. Successful candidates will attend the Summer Session of the The U.S. Particle Accelerator School (USPAS), held June 18-29, 2012 in Grand Rapids, MI, sponsored by Michigan State University. All will take the Fundamentals of Accelerator Physics and Technology with Simulations and Measurements Lab for which undergraduate credit is available. For the remainder of the summer they will work closely with a mentor and a project at either Argonne National Laboratory or Fermilab.
The Lee Teng Internship projects will be selected from among the numerous areas ongoing research at Fermilab and Argonne concerned with accelerator physics and related technologies. These projects may involve operational accelerators or R&D into future or speculative accelerators.
Eligibility: The Lee Teng Internship is open to U.S. citizens and permanent residents who are enrolled full time at an accredited college or university. Applications will also be accepted from foreign nationals who are attending U.S. colleges or universities on student visas.
There are generally formalities that must be completed to allow students on visas to take part in this program. Accepted students are fully responsible for meeting any such requirements.
The program is intended for students who will be completing their junior year in the spring of 2012; however, outstanding sophomores may also be considered.
The construction and operation of accelerators requires a broad range of skills. This program is open to students interested in the following fields:
2. Electrical Engineering
3. Computing and Controls Systems
4. Mechanical Engineering
5. Material Science
See http://www.illinoisacceleratorinstitute.org/submission_of_application.html for application materials and additional information